Application Note (117 in all)
Introduction：AN206 is mainly for GD32H7xx series, scatter loading instruction in Keil.
Introduction：AN136 describes in detail the precautions in the migration process of the IEC60730 ClassB certification library for GD32F30x series chips under different IDEs, and helps customers to achieve IEC60730 standard certification.
Introduction：AN156 describes in detail the precautions in the migration process of the IEC60730 ClassB certification library for GD32F4xx series chips under different IDEs, and helps customers to achieve IEC60730 standard certification.
Introduction：AN171 describes in detail the precautions in the migration process of the IEC60730 ClassB certification library for GD32F3x0 series chips under different IDEs, and helps customers to achieve IEC60730 standard certification.
Introduction：AN192 describes how to use GD32 MCU for spreading frequency testing, and uses GD32F470 as an example to introduce the relevant operation steps and their impact.
Introduction：AN197 describes the module usage precautions when developing on GD32L23x MCUs.
Introduction：AN95 aims to guide customers on ways to improve the accuracy of GD32 MCU temperature sensors.
Introduction：AN195 is designed for the GD32F5xx dual-bank flash product. It introduces the dual-bank code update and switch bank boot function.
Introduction：AN179 introduces the characteristic differences between GD32L235 and GD32EL233 product series, mainly for electric characteristics and peripheral function characteristics.
Introduction：AN175 mainly introduces the GD32A503/A513 series ECC two-bit errors and common handling methods.
Introduction：AN201 mainly introduces that the MCU frequency is high, FLASH can be used to simulate EEPROM to reduce the cost. In this document, a method of simulating EEPROM with FLASH is introduced, which realizes the EEPROM data modification by byte, and can prevent the data lost by software reset or power reset.
Introduction：AN194 is used to introduce how to migrate from the GD32F4xx series to the GD32F5xx series, and related precautions.
Introduction：AN196 mainly introduces that the MCU frequency is high, FLASH can be used to simulate EEPROM to reduce the cost. In this document, a method of simulating EEPROM with FLASH is introduced, which realizes the EEPROM data modification by byte, and can prevent the data lost by software reset or power reset.
Introduction：AN163 provides some EMC protection design references for MCU hardware design, aiming to help optimize the EMC performance of MCU in the product application process.
Introduction：AN146 is mainly used to introduce the differences between GD32E235 and GD32E230 series, including peripherals, electrical characteristics, etc.
Introduction：AN166 mainly introduces the thermal characteristics and temperature management solutions for GD32H7 in high-performance, high-power-consumption scenarios.
Introduction：AN118 introduces the use process and method of GD32H7xx series Licensed Firmware Installation (LFI), and also introduces the operation process of related software.
Introduction：AN051 is designed to help users better solve ESD problems by choosing the right TVS model.
Introduction：AN186 is designed to help users to build and develop GD32VW553 series MCU project in SEGGER Embedded studio for RISC-V (SES) IDE.
Introduction：AN142 introduces the sources and some improvement methods of EMC in motors and their drive systems, helping users quickly understand and optimize key circuits in the drive system.
Introduction：AN161 introduces the various frame formats of GD32F4xx series I2S+DMA communication methods and precautions.
Introduction：AN164 introduces the principle of Dhrystone and the porting method on GD32 MCU.
Introduction：AN167 describes the application configuration and operation of GD32L233 deep-sleep 2 mode to meet the application requirements of low power systems.
Introduction：GD32H7 Series Overview of Secure startup describes the Secure Boot Process, Secure Boot Code, Signature Verification Process, and User’s Boot Image Verification Process.
Introduction：AN125 introduces MCU chip-level RE test methods and precautions to help users quickly understand chip-level RE test.
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